Chinese scientists have achieved a “historic leap” in semiconductor technology by developing the world’s first two-dimensional (2D) industrial chip capable of withstanding extreme radiation levels, according to National Science Review.
The chip, a Field-Programmable Gate Array (FPGA) developed by researchers at Fudan University, is built from molybdenum disulfide, a material far more radiation-resistant than traditional silicon.
Chinese team creates world’s first 2D industrial chip for military use https://t.co/ImyYfXA18l
— South China Morning Post (@SCMPNews) November 4, 2025
Laboratory tests showed the chip remained fully operational after exposure to 10 megarads of gamma radiation, levels that would destroy most silicon circuits.
Researchers say the ultra-thin 2D semiconductor design, less than one nanometer thick, allows faster electron movement, minimal power leakage, and greater durability, making it ideal for military, aerospace, and high-reliability computing.
This breakthrough could give China a strategic edge in developing resilient electronic systems for satellites and defense technologies, while reducing reliance on traditional shielding methods in space hardware.
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TIPP Staff
TIPP Staff
