Apple has announced a multi-year partnership with Broadcom worth more than $30 billion to expand U.S. chip manufacturing, marking the company's largest domestic manufacturing commitment to date.
The report said Broadcom will produce custom wireless components that enable cellular, Wi-Fi and Bluetooth connectivity across future Apple devices.
Broadcom also disclosed that it has signed long-term agreements to develop and supply custom application-specific integrated circuit (ASIC) chips for multiple generations of Apple products through 2031.
Apple said the investment advances its broader $600 billion, four-year U.S. investment plan announced in 2025. CEO Tim Cook thanked President Donald Trump and his administration for supporting efforts to strengthen America's domestic semiconductor supply chain.
Related Tweet:
Apple announced a multiyear Broadcom $AVGO deal worth over $30B to design and produce custom silicon and wireless tech for Apple products. The agreement covers 15B+ U.S.-made chips, with Broadcom investing $1.5B to expand its Fort Collins, Colorado facility. pic.twitter.com/6IAePQtVLu
— Wall St Engine (@wallstengine) July 8, 2026
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